PROJECT 04 / COST MODEL & QUOTE REVIEW
System Cost Model
Six data-center configurations. Explore customer materials and conversion services, compare quotes and test cost changes.
01 / Cost structure
Unit cost breakdown
Material modules as a share of system cost
02 / Supplier settlement comparison
Settlement includes EMS-purchased materials and conversion services. Customer-supplied chips are valued separately; settlement is not total system cost.
| EMS supplier | Modeled fee | Simulated settlement | Quote minus model | System cost incl. customer materials |
|---|
03 / BOM cost detail
Expand a module to inspect cumulative system quantities and scenario prices. Parent modules show structure and are not priced again.
Process assumptions & methodology
Customer-supplied chips: ASICs, CPUs, BMC/CPLD, onboard DDR and boot flash. RDIMMs, SSDs, optical modules and mixed component kits are EMS-purchased. This page dynamically compares both sourcing modes; downloaded tables 10–11 retain the original all-customer-material baseline.
Materials use the selected quarter’s prices and BOM quantities. Labor uses attended minutes. Equipment covers SMT, functional testing and burn-in rack costs allocated across concurrent units. Overhead applies to conversion costs. Profit markups apply separately to conversion and EMS materials, never to customer-supplied chips.
Customer material loss and EMS material loss are separate; this version assumes the same allowance rate. Scenarios compare with the same product, quarter and supplier’s bare-system baseline. Annual impacts use fixed simulated demand.
All models, prices, quotes and process assumptions are fictional. Software licenses, warranty, freight, duties and NRE are excluded. Results are neither actual transactions nor validated engineering designs or realized savings.
Structure references: NVIDIA hardware manual · Dell technical guide